Disco Corporation

Disco Corporation, headquartered in Tokyo, Japan, is a global leader in precision cutting, grinding, and polishing equipment for the semiconductor, electronic components, and other high-tech industries. Founded in 1937 as Dai-Ichi Seitosho Co., Ltd., the company initially focused on manufacturing precision tools and machinery for various industries. In 1960, it developed Japan’s first diamond saw for cutting hard materials, marking a significant milestone in its history.Throughout the decades, Disco Corporation has continued to innovate and expand its product offerings, playing a crucial role in advancing the semiconductor manufacturing process. The company’s cutting-edge technologies have contributed to the development of smaller, faster, and more efficient electronic devices.In the 1980s and 1990s, Disco Corporation expanded its operations globally, establishing subsidiaries and sales offices in key semiconductor manufacturing regions worldwide. This strategic expansion enabled the company to better serve its international customers and strengthen its position as a leading provider of semiconductor processing equipment.Today, Disco Corporation offers a comprehensive range of products, including dicing saws, laser saws, grinders, polishers, and related consumables and services. With a focus on precision, reliability, and technological innovation, Disco Corporation continues to be at the forefront of the semiconductor manufacturing industry, driving advancements in semiconductor production processes worldwide.